LTCC / HTCC

Natel is North America’s leading manufacturer of quality LTCC substrates, packages.

Natel offers Low Temperature and High Temperature Co-fired Ceramic (LTCC/HTCC) technology as a unique solution for high interconnect density, compact networks and high frequency applications. Natel supplies the customer with a totally integrated packaging solution to real-world problems by employing all of the following advantages of LTCC/HTCC technology:

• Embedded Passive Components (RLC)
• High Density Interconnect
• Cost Competitive Plated Silver Systems Available
• TCE Closely Matches that of Si, GaAs and SiC (and other associated compounds)
• Brazed on Components (Connectors, Seal Ring, Heat Spreaders)
• Hermetic Packaging
• Outstanding Long Term Reliability

LTCC Photo Gallery

Dupont LTCC with unique dimensions and fine pitch top conductor
LTCC with mounting holes, pins, and hermetic seal ring
Ferro LTCC with compartmentalized seal ring, heat sink, and cavities
Copper Thick Film

Thin Film

ALN (Aluminum Nitride Ceramic Substrates and packages)

Much like LTCC, Aluminum Nitride Ceramic substrates are processed in the factory utilizing many of the same processes. The most significant difference is in the firing of the ALN material. Because ALN is an “HTCC” substrate it is fired at much higher temperatures.

The most significant advantage of ALN is its exceptional thermal performance, low thermal expansion and non-toxicity.

THICK FILM

Natel provides next generation Thick Film Substrates Enhanced Circuits Processing (ECP). Natel can provide standard Thick Film Substrates used in most signal and low power applications. Additionally, Natel can provide our ECP Thick Film Substrates suitable for microwave and high-resolution lines and space applications. The Thick Film conductor material is fired in a dense, non-porous film over a large area of the substrate. The high resolution lines are then defined using photoresist and etch techniques to achieve widths and spaces as low as 0.003" (0.0762mm).

The ECP process is based around standard thick film Au that is already qualified by many OEM's, thus avoiding long qualification cycles, so that new designs get to market quickly. ECP technology allows designers to combine RF and digital functions on substrates, and offers options for integrating capacitors, resistors, inductors, couplers, and filters. Capacitors and resistors can be laser trimmed to obtain +/-3% and +/-1% tolerances, respectively.

ECP Features & Benefits

• High frequency applications through 100 GHz
• On-circuit integration of passive components including Lange couplers, resistors (0.5 Ohm - 100 m Ohm, trimmed to 1%) and capacitors (5 - 200pF, trimmed to 3%), inductors, couplers, and filters.
• Etched conductors [0.001" (0.0254 mm)] lines/spaces
• Precision layer to layer dielectric alignment (+/- 12.5 micron) in multilayer construction
• Dense, solid thru-holes [0.007" (0.178 mm diameter)] for interconnection/grounding
• Gold or Silver conductors
• Compatible with Al203, ALN, and Be0
• Substrate sizes up to 4.0" X 4.0"
• 30% to 50% lower insertion loss

FACILITIES AND EQUIPMENT

• 3 multitarget sputtering systems with RF IDC magnetron capability.
• 3 target, load-locked machines are available for high volume orders.
• Multisource thermal and e-beam evaporation systems.
• Ion-beam deposition system
• 3 Ion-beam etching systems to provide 0.0001" geometry control.
• Complete analytical and quality control equipment including line-width
• All coating equipment is cryopumped

4,800 Square Foot Thick Film Assembly Natel's modern Thick Film facility is the basis for high quality prototype or volume production substrates. Beginning with the cleaning and inspection of the bare ceramic for cracks, scratches, warps or bowing, to the overall functional testing of the finished substrates for isolation and continuity, and when required, exact resistor values over temperature. Substrates are built with Natel's mark of excellence.
• Housed in a class 10K clean room • Self contained dark room for screen fab • 6 linear IR furnaces • 1 Muffle furnace • 13 Semi-automatic T/F printers • 2 Large area T/F printers • 3 automatic open/short test stations • 1 Class K resistor test station for pre & post trim test • In line ink dryers
Thick Film Printing • Class 10K clean room • Complete Thick Film capability in one room   - Screen fabrication/dark room   - Print and fire   - Circuit test (open/short and resistor value) • Large area for expansion
	Thick Film Printing
Furnace Room • Curtain separation from print room, with a positive air differential between print and furnace room • Thick Film dryers in-line with furnace • Real time furnace temperature profile with stand-alone recorders • All furnaces fed with clean (3 filters) and dry air
	Furnace Room
Natel has complete Thick Film capability. This includes being able to print multiple-layer conductors (up to 13 metal layer conductors), as well as through-hole capability - we can print a conductor from one side to the other side of a thick film substrate. We have a certified Class K resistor print, test and trim area, a complete darkroom that supplies our Thick Film lab with Thick Film screens, which are the actual heart of any Thick Film lab. We have five radiant energy furnaces and one muffle furnace. We have ten standard 8" x 10" screen printers and two 12" x 14" large area screen printers (the standard screen printers would yield a substrate as large as 3" x 3", and the large area screen printer would yield a ceramic substrate as large as 6" x 6"). The Thick Film lab is housed in a 4,800 square foot Class 10,000 Clean Room. Substrates are coded for traceability and materials. Inks and pastes are chosen using a systems approach to ensure compatibility to your application. The key is to meet your overall specifications.