Substrates:

• Thick Film Ceramic (Al2O3 & BeO)
• Direct Bond Copper (Al2O3 & BeO)
• Thin Film
• LTCC/HTCC/ALN Ceramic with buried RF filters
• FR4/Rogers/Duroid PCB's with buried RF filters

Component Attach:

• Epoxy
• Solder
• Flip Chip, µBGA & QFP
• Eutectic
• Fluxless Soft-Solder

Packaging:

• Aluminum
• Kovar
• Titanium

Wire Bond:

• Gold Ball (0.7 to 3.0-mil)
• Gold Wedge
• Gold Ribbon
• Aluminum Wedge (0.7 to 20-mil)
• Aluminum Ribbon

Hermetic Package Sealing:

• Laser Welding
• Inert Gas Sealing Environment
• Fine/Gross Leak Testing
• Nitrogen Bake
• Vacuum Bake

Bare Die Attach

• MRSI 505 & Palomar 3500 Work Cells used to place bare ICs out of waffle/gel packs
• Options include:
• Eutectic Die Attach
• Rotary Flux Well
• Tape Feeders
• Hi-Res. Flip Chip Camera

Fluid Dispense

• Asymtek C-720 Fluid Dispenser used for Epoxy/Flux/Solder Dispensing
• Options:
• Heated Vacuum Stage
• Dual Head Design
• Rotary Auger Valve
• Positive Displacement Valve for Flip Chip Underfill
• Closed Loop Measurement for Fluid Viscosity

Package Seal

Natel has one of the most complete package seal areas in the industry. Just about any type of package or weld technique can be accomplished. Our newest addition to package seal is our automatic linear welding system. This system allows packages to be sealed by picking up, positioning, tack welding and then sealing the hybrid or module automatically. There are also manual linear weld systems, one-shot or induction weld systems and solder/eutectic seal systems.

• Housed in a Class 1K clean room
• 1 Fully automatic linear weld system
• 5 Semi-automatic linear weld systems
• 1 Linear hydrogen furnace cover seal system
• 2 DAP seal system
• 1 One-shot resistance weld system