Box Build/System Assembly

Overview

Natel has been manufacturing Box assembly products for over 30 years. The Box or system assembly products combine microelectronic Hybrids and MIC's produced, sealed and fully tested in our in-house MIL-STD 38534 microelectronics facility with on board through hole, SMT, wire harness and other Military connection terminations, box assembly and associated wiring abilities.

Highlights of our BOX and SYSTEM assembly division are:

AS9100 Certified
J-STD-001 Certified
IPC-A-610 Class I, II, III Certified
ISO 13485 Compliant
FDA 21CFR Part 820 Compliant
Testing to MIL STD 883
Round cable assembly
Discrete wire harness fabrication
Electronic, thermal and mechanical design capabilities
Military connection termination
Metal box fabrication and finishing

High Accuracy High Resolution Dynamic Modulation Includes 4 related instruments Complete programmability	25 W to 30 KW Multiple outputs Commercial, industrial, military grades Modular, VMI, compatible, rack mount EMI and environmental testing Power factor correction
Build-To-Print Box Build & Next Level Integration Circuit Card and Cable Integration	Custom Enclosures Connectors

Box Build/System Assembly Photo Gallery

Manual Assembly

Clean Room

The manual assembly lines in Clean Room #1 are designed to give our customers flexibility for prototype and low volume production. Natel typically uses these lines for high-reliability military and space hybrids where the hybrid construction or volume do not lend themselves to automatic assembly. Although these are manual lines, the equipment is arranged so that there is a continuous flow of parts from one end to the other end. Also, the line is balanced so that each station produces the same quantity of hybrids per day.

Housed in a Class 10K clean room
Relative humidity and temperature controlled
Extensive ESD controls
Custom automatic and manual test
Four separate manual assembly lines

Active Laser Trim 4 ESI active laser trim stations Computer controlled signal and load application Computer driven trim with active electrical parameter feedback Associated support equipment utilizing GPIB instruments and VXI technology
Stand-Alone Plasma Clean Automatic program capability Large volume chamber Auto gas mix system
Manual Gold Wire Bond .0007" to .003" wire capability Automatic Z and step back Manual Z over ride capability
Semi-Automatic Epoxy Dispense 5,000 dots per hour Precision epoxy dispense at ± .002" Automatic program storage
Semi-Automatic Die Attach Vacuum pick up Auto die release Large work area for substrate or package
Linear Package Seal Two seal head system Step lid and bathtub lid seal capability 3 vacuum bake-out ovens Nitrogen and helium chamber
Semi-Automatic Wire Pull Auto data print out .0007" to .020" wire pull capability Program storage

ITARs Registered