Facility Tour

State of the Art Equipment & Facilities – Other Operations

Other Operations

Natel has developed processes that are special techniques to accomplish many microelectronic tasks such as form leads on all types of packages, (even fragile ceramic sidewall packages), de-lid all types of sealed metal lidded packages (including round packages), automatically insert and solder side attach, through-hole pins, and many more operations.

Lead Formation

Complete line of custom lead bend tools
Pneumatic Fancort compression tool for all bend fixtures
Precision bend for ceramic packages

Automatic Ink Jet Marking Military marking permanency capability Automatic program storage Patterns for logo printing Can print serial number, date code, bar code, logos, etc.
Package De-Lid (Photo 1) Both square and round package Programmable
Package De-Lid (Photo 2) Both square and rectangular package Programmable
Ionized Water Clean System Water resistivity meter Can be aqueous or semi-aqueous Supplies only clean salt-free water to all Natel aqueous cleaning systems Automatic water level sensors
Automatic Side Soldered Pin Insertion System Automatic pin feed Pins are soldered loaded for easy reflow Reflow temperature profile in memory Auto inspection for proper pin/board alignment
Closed Loop Solvent Cleaning System On board solvent distiller Both automatic and manual cleaning chambers Cleaning programs stored in memory Self contained solvent reservoir Nitrogen purged system including exit chambers
*Other Operations* Continued

ITARs Registered