Employment

Following are opportunities currently available with Natel Engineering:

For immediate consideration, please email or fax your resume and salary history to the contacts below - USE REFERENCE NUMBER AND JOB TITLE.

Contact: Human Resources SUBJECT LINE - REF # AND JOB TITLE
Contact Fax: 818-734-6515 Attn: Human Resources - USE REF # AND JOB TITLE

Job Location: Chatsworth, CA 91311

APPLICANTS for all positions MUST BE US CITIZENS OR PERMANENT RESIDENTS.

Job Title: RF Test Technician

• AA degree or military trade school, or equivalent
• At least 5 years electronic experience
• Knowledge of digital, analog and RF circuits
• Ability to read and understand schematics
• Operate electronic test equipment
• Strong electronic theory and troubleshooting skills (component level preferred)
• Micro-electronics or Hybrid experience preferred
• Must also be able to tune and troubleshoot RF assemblies
• Technical knowledge of electronic principles to solve basic problems using diagrams, schematics, engineering data and test equipment
• Must be able to obtain a Department of Defense Secret Security Clearance

Natel offers a competitive salary and benefits package based on experience, including medical and dental insurance and a 401K plan. For immediate consideration, please email or fax your resume and salary history to the contacts below. APPLICANTS MUST BE US CITIZENS OR PERMANENT RESIDENTS AND BE ELIGIBLE TO HOLD A SECURITY CLEARANCE. EOE M/F/D/V

Contact: Human Resources

Contact FAX (818) 734 6515

Job Title: Assistant Ceramics Engineer-RF2006-001

Duties: The individual will be responsible for supporting the production and manufacture of ceramic substrates (LTCC, Thin Film, Thick Film) and developing processes for new designs and products. In addition, the person will be required to develop strategies to ease manufacturability of customer designs, analyze and identify problems with existing products, initiate and implement process improvements, perform and design experiments and participate and present results and conclusions to the customer.

Essential Qualifications:

• 1 to 3 years experience in the ceramics industry
  
• Good knowledge of LTCC and Thick Film processes
• Competency in experiment design/ statistical data evaluation, and understanding of basic engineering principles
• High level of initiative, motivation and energy
• Excellent analytical and problem solving ability
• Computer skills including MS Word, Excel and Power Point
• A BSc in Mechanical / Materials / Ceramic Engineering

Job Title: Microelectronic Assembly Process Engineer - RF2006-003

Duties: The duties include working with the production and R&D staff to determine appropriate die attach, solder and eutectic attach applications for specific assemblies, recommending wire bonding procedures for gold ball and wedge and aluminum wedge and large aluminum wires and programming automatic wire and die attach machines for production. In addition, the person will be required to work with the different package seal methods, including linear weld, one shot resistance weld, laser weld and hydrogen fluxless furnace seal methods. The applicant will be required to supervise other technical staff working on these processes and be responsible for their training and development.

Essential Qualifications: The applicant will have either a BSc in mechanical, materials or ceramic engineering or 5 – 10 years experience in the microelectronics industry. A background in all phases of microelectronics assembly such as thick/Thin Film circuit design, die attach, wire/ribbon bonding, linear, induction and laser welding, solder process and materials, BGA assembly etc. is required. Working knowledge of LTCC is highly desirable and the applicant will be familiar with the requirements of MIL-STD-38534.

Job Title: Thin Film Process Engineer - RF2006-005

Duties: The individual will supervise staff and manage the Thin Film processes at Natel on a “hands-on” basis. This includes the blending of resistor inks, conductor thinning, print set up, screen makeup, furnace profiling etc. In addition, the candidate will be responsible for other specialty printing such as edge printing, through hole, filled via and fine line printing and thick etch back printing. Training of line staff and process development and documentation will be required functions, together with working with the production staff to ensure on time delivery.

Essential Qualifications: The applicant must have a background in Thin Film circuits made on a variety of substrate materials. Experience in Thin Film circuit design, Thin Film sputtering process, patterning and etching, sputtering materials, Thin Film coatings etc. is required. A good working knowledge of solid filled vias and plated through hole and slots and electroplating is –10 years in the industry is preferred.

9340 Owensmouth Ave., Chatsworth, CA 91311
Attn: Human Resources

Contact: Human Resources