Capabilities

Natel's basic assembly and packaging capabilities are as follows:

Assembly Technologies

• Standard Thick Film
• High-Density Thick Film
• Ball Grid Array
• Flip Chip
• Epoxy, Eutectic and Solder attach
• Automatic and Manual Chip & Wire
• Automatic and Manual Chip & Ribbon
• Plated Through-Hole
• Beam Lead
• Surface Mount Technology

Packaging Technologies

• LTCC / AlN Modules
• Hybrids
• Chip-On-Board
• DWDM Modules
• MCM-L and MCM-D
• Optoelectronics Packages