Capabilities
Natel's basic assembly and packaging capabilities are as follows:
- Standard Thick Film
- High-Density Thick Film
- Ball Grid Array
- Flip Chip
- Epoxy, Eutectic and Solder attach
- Automatic and Manual Chip & Wire
- Automatic and Manual Chip & Ribbon
- Plated Through-Hole
- Beam Lead
- Surface Mount Technology
Packaging Technologies
- LTCC / AlN Modules
- Hybrids
- Chip-On-Board
- DWDM Modules
- MCM-L and MCM-D
- Optoelectronics Packages
| © NATEL ENGINEERING CO., INC. All Rights Reserved. • Privacy Statement Webmail Log-in |
 |
"Export of products, software and technologies included on our web site are subject to the export restrictions of the International Traffic in Arms Regulation (ITAR), and/or the Export Administration Regulations (EAR). Diversion contrary to U.S. export laws is prohibited." |