Process Capabilities
THIN FILM SERVICES
- Sputtered Metals: TiW Au, Cr, Cu, NiCr, TiW Al, TaN, Ni Au,
Pt, Pd, SiO2, etc. - Au, Ni, Cu, electroless Cu, electroless Au & Ni plating processes
- Substrates: Alumina, Silicon, BeO, Aluminum Nitride, Quartz, Sapphire, etc.
- Conductor width and spacing of 12 microns (.0005")
- 3 multitarget sputtering systems with RF / DC magnetron capability.
- 3 target, load- locked machines available for high volume orders.
- Multisource thermal and e-beam evaporation systems
- Ion-beam deposition system
- 3 Ion-beam etching systems to provide 0.0001" geometry control
- Complete analytical and quality control equipment including
line-width - Cryopumping for all coating equipment
- Semi-automatic standard and large area Thick Film screen-printing
- Automatic open/short testing
- Both muffle and IR firing furnaces
- Class H & K resistor testing
- Passive laser trimming
- Full dark room for Thick Film screen development
SMT
- Automatic SMT assembly as sub-assembly for a microelectronic module (02-01)
- Use of water-soluble solder paste
- Aqueous clean
- Standard fully automatic SMT assembly
COMPONENT ATTACH
The following materials can be dispensed, screened, auto placed or stamped:
- Epoxy (conductive and non-conductive) for die and passive component attaches
- Epoxy preforms for substrate and large area component attach
- Solder and Eutectic for power component attach
PICK AND PLACE CAPABILITY
- Automatic component placement to .001" accuracy
- Semi-automatic pick and place capability
COMPONENT INTERCONNECT
- Wire bonding aluminum (.001" to .020") capability
- Automatic wire bonding gold ball (.0007" to .003") capability
- Wire bonding gold wedge (.007" to .003") capability
- Automatic ribbon bond (.0005" X .003" to .003" X .015")
- Tab bonding
- Flip-chip attach and re-flow
SPECIAL ASSEMBLY CAPABILITY FOR HIGH FREQUENCY, FINE PITCHED AND CONTROLLED IMPEDANCE ASSEMBLIES
- Controlled wire and ribbon bond lengths, including loops
- Special pick-up tools and methods for Air Bridge, MMIC, and thin GaAS die
PRE-SEAL TESTING
- 20+ automatic and manual RF hybrid test stations
- Auto test UTS-625W power test system
- IEEE 488 Rack & Stack
- HP3060A (in-circuit test)
- Active laser trim
- Analog Devices LTS2020
- Lorlin double impact, discreet semiconductor tester
- Custom testing
PACKAGE SEAL
- Manual linear weld
- Automatic linear weld
- One-shot induction weld
- Hydrogen furnace solder seal
- Epoxy preform seal
ENVIRONMENTAL TESTING
- Stabilization bake
- Temperature cycling
- Centrifuge testing (constant acceleration)
- Particle Impact Noise Detection (PIND)
- X-Ray
- Fine and gross leak testing
- Burn-in (Air and liquid)
ADDITIONAL CAPABILITIES
- BGA (low cost prototype & production)
- Flip chip & underfill
- Moisture resistant junction coating (Glob-top)
- Dam & fill for wire bond & die protection
PACKAGE TYPE CAPABILITY
- Standard glass to metal seal hermetic packages
- High temperature ceramic to metal seal hermetic packages
- High temperature co-fired ceramic (HTCC & ALN) packages (hermetic or non-hermetic)
- Side brazed
- Flat pack
- Leadless chip carriers (LCC)
- Ball grid array (BGA)
- Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic)
- Side brazed
- Flat pack
- Leadless chip carriers (LCC)
- Ball grid array (BGA)
- Optoelectric MEMS packages with the following feedthroughs:
- RF or optical
- Glass window
- Solid seal
- Valve inlet
- Glass tube
- Glass tube with getter
- TO packages
- Multi-chip-modules, MCM (ceramic, FR4)
- MCM-L
- MCM-D
- Custom packages (hermetic, moisture resistant and non-hermetic)
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