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Packaging
You already may have a package dictated by your application. We can assist in circuit layout to optimize your needs, or we can recommend an appropriate package for you.
A broad range of package sizes, types, shapes and materials are available. From plug-in style to flat packs and chip carriers, they can be made of kovar, cold rolled or stainless steel, molybdenum, copper, ceramic or a combination thereof. A variety of finishes are also possible, including gold or nickel.
Available packaging technologies include:
- Multi-Chip Modules
- Hybrids
- Chip-On-Board
- DWDM Modules
- MCM-L and MCM-D
- Optoelectronics Packages
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