Thin Film Services

• Sputtered Metals: TiW Au, Cr Cu, NiCr, TiW Al, TaN, Ni Au,
  Pt Pd, SiO2, etc.
• Au, Ni, Cu, electroless Cu, electroless Au & Ni plating processes
• Substrates : Alumina, Silicon, BeO, Aluminum Nitride, Quartz, Sapphire, etc.
• Conductor width and spacing of 12 microns
• 3 multitarget sputtering systems with RF / DC magnetron capability.
• 3 target, load- locked machine available for high volume orders.
• Multisource thermal and e-beam evaporation systems
• Ion-beam deposition system
• 3 Ion-beam etching systems to provide 0.0001" geometry control
• Complete analytical and quality control equipment including
  line-width
• Cryopumping for all coating equipment

FACILITIES AND EQUIPMENT

• 3 multitarget sputtering systems with RF IDC magnetron capability.
• 3 target, load- locked machine is available for high volume orders.
• Multisource thermal and e-beam evaporation systems.
• Ion-beam deposition system
• 3 Ion-beam etching systems to provide 0.0001" geometry control.
• Complete analytical and quality control equipment in_cluding line-width
• All coating equipment is cryopumped

SERVICES AND CAPABILITIES

• Thin Film Coating Services/ Sputtering
• Thermal Evaporation, Ion-Beam Deposition
• Thin Film Photolithography
• Wet Chemical Etching and Ion-Beam Milling
• Diamond Dicing
• Laser Cutting/Vias

Thin Film Coating / Sputtering

Natel offers complete thin film coating services by sputtering. Sputtering is the process where an inert gas such as Argon is ionized and bombards a target of the material one would like to coat. Sputtering allows either metals or dielectrics to be deposited onto almost any substrate.

Metals
Metals which are routinely deposited include:

Dielectrics/linsulators
Dielectrics can be coated onto many types of substrates utilizing RF or RF Magnetron sputtering. Dielectrics routinely deposited include:

Resistor Materials-TaN, 30 to 100 ohm/sq.
NiChrome or NiChromeSilicide

Thermal Evaporation, Ion-Beam Deposition

Ion Beam Deposition is a process of applying materials to a target through the application of an ion beam. In an ion source, gasses or evaporated solids are ionized using electron ionization.

[diagram]
3 Sources
6 - 6" platens

Ion assisted deposition utilizing two ion-guns
Adjust energy on substrate to control structure

Thin Film Photolithography

• Substrate sizes to 6" x 6"
• Contact or Proximity exposure
• Two sided aligner for front/backside patterning

Wet Chemical Etching and Ion-Beam Milling

Wet Chemical Etching Au pattern etching in KI
Ni, Cu, TiW, Cr, Al, and other materials etched to pattern

Ion-Beam Milling Dry etching to very tight tolerances
Linewidth tolerance +/-0.0002"
No chemical undercut, exceptional quality

Diamond Dicing

The superior edge quality that a diamond saw provides is no comparison to the standard laser pulsed edges from scribing. For substrates that are printed and require singulation, the amount of contamination from cutting is considerably less than lasering. More importantly, the diamond saw is capable of holding incredible accuracy. Dicing of cells as small as .010 x .010 x .010 and kerf widths of ± .0002 are easily maintained.

Laser cutting/Vias

We offer single heads for optically critical post processing, and quad heads for high volume production runs. We are sure to have the capacity to handle all of your production demands.

THIN FILM DESIGN GUIDELINES

Natel Thin Film Design Guidelines (Microsoft Powerpoint 2MB)

PHOTO GALLERY