LTCC / AIN Substrates & Packages

OVERVIEW

Natel offers Low Temperature Co-fired Ceramic (LTCC) technology as a unique solution for high interconnect density, compact networks and high frequency applications. Natel supplies the customer with a totally integrated packaging solution to real-world problems by employing all of the following advantages of LTCC technology:

• Excellent High Frequency Performance
• Dielectric Constant: 7.8 at 3 GHz (951), 7.4 at 40 GHz (943)
• Loss Tangent: 0.006 at 3 GHz (951), 0.002 at 40 GHz (943)
• Dielectric Constant is Stabile Over a Broad Frequency Range
• No Moisture Absorption (which is common to Multi-layer Organic Substrates)
• Embedded Passive Components (RLC)
• High Density Interconnect
• Cost Competitive Plated Silver Systems Available
• Excellent Thermal Management
• TCE Closely Matches Si, GaAs and SiC (and other associated compounds)
• Brazed on Components (Connectors, Seal Ring, Heat Spreaders)
• Hermetic Packaging
• Outstanding Long Term Reliability
• Field Proven

LTCC is a parallel fabrication process that allows for complex, high density designs with high reliability and excellent mechanical and electrical properties.

Natel is North America’s leading manufacturer of quality LTCC substrates, packages, as well as thick film circuits. From multilayer substrates and LTCC, to lower-cost microwave circuitry featuring etched conductors, — Natel is your innovator in thick film processing. Our specialties include:

Exclusive, ceramic-based thick and thin film solutions,

Whatever your product requirements, Natel will apply our 20 years of LTCC and thick film experience to solve your most difficult challenges. A wide variety of the latest technologies and materials, along with the engineering experience to utilize them in the most cost-effective fashion, enable us to provide solutions other suppliers simply can't match.

In the area of substrates, Natel solutions include features such as filled, hermetic substrate vias, edge wraps, integrated resistors, capacitors, and inductors. And throughout, we employ the latest materials and processing technologies. In addition to our extensive LTCC capabilities, Natel can handle a wide variety of additional substrate materials such as alumina, aluminum nitride and beryllia for maximum design flexibility.

Vertical integration

Need design assistance, ceramic machining, thick film screening or thin film services. How about etching, plating, laser trimming, and comprehensive product testing? Natel offers it all under one roof — for reduced costs, speedier turn times, and the advantages of an engineering staff with over 200 years of combined, hands-on experience.

Products for a diverse customer base

At Natel, we work with customers in such diverse fields as medical, wireless, optical, automotive, aerospace, aviation, and other high end industrial industries. The varied and exacting demands of these sectors have made us proficient in developing all kinds of low-cost, quick-turn prototypes. They have also enabled us to compress our design-to-production cycle times and match our capacity to your low- or high-volume manufacturing needs.

The added confidence of Natel

If your project calls for specialized RF/Microwave packaging or substrate know-how, you can count on Natel’s 31 years of successfully creating solutions for America’s most demanding customers.  Call us at 818-734-6500 when you need the expertise, experience, and capabilities to make those solutions real.

LTCC PRODUCT APPLICATIONS

NATEL LTCC DESIGN GUIDELINES

RELATED INDUSTRY INTERNET LINKS

Dupont Electronic Materials Division
Electro Science Labs -  Thick Film Materials
Ferro Corp. Electronic Materials Division

LTCC PHOTO GALLERY

Dupont LTCC with unique dimensions and fine pitch top conductor
LTCC with mounting holes, pins, and hermetic seal ring
Ferro LTCC with compartmentalized seal ring, heat sink, and cavities
Copper Thick film