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Manufacturing Overview
- AS9100 Certified
- MIL PRF 38534 (Class H & K) Certified
- ISO 13485 Compliant
- FDA 21 CFR Part 820 Compliant
- Lean Manufacturing using NPS (Natel Production System)
- Application: Military, Aerospace, Medical, Telecom.
- Technologies: Signal, Digital, RF Microwave, Power, Photonics & Optoelectronics
- EPICOR ERP system
- Class 10K clean rooms
- Dedicated Cellular Manufacturing Lines
- Upfront Process Characterization
- SPC (Statistical Process Controls)
- White Paper Process Development
- > 96% first pass manufacturing yields
Die Attach Quick Reference
Design Guide
Thermal Management
Quick Reference Design Guide
Wire Bond Quick Reference
Design Guide
Hybrid Microelectronics Photo Gallery
Hybrid Markets Served
Processes and Materials
Component Attach:
- Epoxy
- Solder / DAP
- Flip Chip, µBGA & QFP
- Eutectic
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Lid Seal:
- Linear / Parallel Package Weld
- Laser Package Weld
- Laser Feed Weld
- "One-shot" Induction Weld
- DAP / H2 Package Seal
- Linear H2 Furnace Seal
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Interconnect:
- Gold Ball (0.7 to 2.0-mil)
- Gold Wedge
- Aluminum Wedge (0.7 to 20.0-mil)
- Gap Weld
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Package Capability:
- High temperature co-fired ceramic (HTCC & ALN) packages (hermetic or non-hermetic)
- Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic)
- Optoelectric MEMS packages
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Test and Environmental Screening
- Rack & Stack Test Systems (GPIB controlled)
- Testing Over Full Temperature Range
- VLSI and IC Digital Testing (Contracted)
- Power Semiconductor Testing
- Broadband Testing (L – Ku Band)
- RF & Microwave Testing
- RF Circuit Tuning
- MIL-STD-883
- Temperature Cycle
- Constant Acceleration
- Burn-in & Life Test
- Leak Test
 A1100 & A1200 Test Stations
Super Microelectronic Assembly Line
Here at Natel, our microelectronic assembly capabilities include just about all of the processes required to build a hybrid
microelectronic or MCM module today. They include ball-grid-array, chip-on-board, chip and wire, plated through-hole, surface mount technology,
multi-chip technology, and mixed technology, or many technologies under one roof.
- Housed in a Class 10K clean room
- Continuous and contiguous automatic line
- Automatic boat transfer system (SMEMA compatible)
- Automatic epoxy dispense
- Automatic precision die placement
- Linear epoxy cure
- Plasma clean
- Automatic wire bond
- Automatic wire pull
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Speedline 2800 Automatic Epoxy Dispense
- 15,000 dots per hour
- Position accuracy of ±.003"
- Auto pattern alignment recognition
- 18" X-Y travel
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MRSI 505 Automatic Component Attach
- Ultra precision placement of ± .0005"
- High-speed placement @ 1,200 per hour
- Fully automatic pattern recognition system
- In-line adjustable conveyer
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BTU VIP-98N In-Line Linear Epoxy Cure Furnace
- Precision epoxy cure system
- Nitrogen purged
- 22" stainless steel belt
- In-line with adjustable width conveyor
- Precision digital temperature profile
- 7 zones, including cool-down zone
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In-Line Linear Furnace Off-Load System
- In-line automatic furnace unload
- Multiple speed adjustment
- Unloading alarm
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Stand-Alone Plasma Clean System
- Yield engineering batch system
- Multiple gas mixing
- Nitrogen purged
- Automatic computer controlled cycle
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K&S 1488 Turbo-Plus Fully Automatic Wire Bonder
- Fine pitch
- 90-mil pattern recognition optics
- Automatic magazine loader and unloader
- 13,000 wire per hour
- Controlled ball size and loop height
- Multiple heat stages
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DAGE BT-25 Automatic Wire Pull
- Fully automatic NDWP
- AQL wire pull
- Fully automatic wire pull
- 100% or AQL
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Standard Linear Weld
- Automatic program storage capability
- Nitrogen bake-out oven
- Nitrogen and helium weld
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