Printed Wire Board Assemblies

Manufacturing Overview

AS9100 Certified
J-STD-001 Certified
IPC-A-610 Class I, II, III Certified
ISO 13485 Compliant
FDA 21 CFR Part 820 Compliant
Lean Manufacturing using NPS (Natel Production System)
J-STD-001 and IPC610 certified processes and employees.
Application: Military, Aerospace, Medical, Telecom, Commercial & Industrial Electronics.
Technologies: RF, Microwave, Power, Photonics & Optoelectronics
Low to High Volume Production
SMT and Thru Hole Assembly
EPICOR ERP system
Automatic and Manual Cellular Manufacturing Lines with built in SMEMA configurations
Upfront Process Characterization
> 97% first pass manufacturing yields
ESD Control Program per EIA-625
DSCC approved Configuration Control System

Printed Wire Board Assemblies Photo Gallery

Materials, Processes and Test

PC Boards:

LTCC/HTCC/ALN Ceramic
FR4/ Polyamide
Rogers/Duroid PCB's
Laminate and Flex

Component Attach:

Leaded and Lead Free Solder
Water Soluble/No Clean/ RMA Flux
0201 component ,BGA & QFP
5 Zone BTU Reflow Oven

Cleaning:

Closed Loop Di Water system
Ionic Contamination verification and test

Inspection:

100% Visual Inspection
X-rays
IPC 610 Class 2 & 3

Test:

In- Circuit Testing ( ICT) or Full Functional Testing (as required)

Super SMT Line

SMT (Surface mount technology) was developed in the 1960s and became widely used in the late 1980s. Since that time many advances have been developed. NATEL has taken SMT to the next level for high reliability Military, Space , Medical and other MIL-STD products. Natel has combined microelectronic epoxy dispense with normal solder screening capabilities to create a unique approach to SMT. Often only the solder joints hold the parts to the boards, but by adding an in line epoxy dispense machine parts are mechanically secured with a dot of adhesive as well as the solder joints. Surface mounted devices (SMDs) are usually made physically small and lightweight for this reason. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of their equivalent through-hole parts.

SMT Quick Reference
Design Guide

Super SMT Assembly Line

Natel's SMT assembly area has a continuous, contiguous, automatic assembly line for just about any kind of substrate - thick or Thin Film ceramic substrate or PC Board - using solder or epoxy techniques, capacitors, resistors or any type of solder terminated components.

Housed in a clean zone area
Continuous and contiguous automatic line
Automatic product transfer system
Automatic vision guided stencil print
Automatic material dispense
Automatic precision component placement @ 35K per hour
Linear solder reflow
Linear aqueous or semi-aqueous cleaner

Sanyo TPM-1100 Solder Print Fully automated Vision guided recognition system 12-mil fine pitch capability Large area print capability
Asymtek Automatic Material Dispense In-line Solder or epoxy dispense Automatic pattern storage Fine line and dot dispense
Sanyo TCM-1100 Chip Shooter 35,000 components per hour 240 component feeders Large area placement 0402 placement capability
BTU Reflow Oven Five heat zones Precise digital temperature profiles Large area board capability
In-Line Board Flipper Large area board capability Automatically turns boards for backside assembly
Magazine Loader and Unloader Large area board capability Can hold up to 400 boards Automatic magazine changer
Aqueous or Semi-Aqueous Cleaner Large area board capability Clean, continuous DI water supply system In-line water resistance measurement

Thru-hole Assembly

J-STD-001 Certified Operators
ITC-A-610 Certified
3 separate lean lines
WAVE Soldering Machine

ITARs Registered