Section 1: Thick Film |
Section 2: Super SMT Assembly Line |
Section 3: Super Microelectronic
Assembly Line #1 |
Section 4: Super Microelectronic
Assembly Line #2 |
Section 5: Super Microelectronic
Assembly Line #3 |
Section 6: Manual Assembly Lines |
Section 7: Package Seal |
Section 8: Environmental Testing |
Section 9: Burn-In |
Section 10: Electrical Test and
Active Laser Trim |
Section 11: Final Inspection |
Section 12: Other Operations |